Dynatron J1 - Processor heatsink - passive - (for: Socket SP5) - copper with vapour chamber base - 1U | A 2746 / J1
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Product Features
- Efficient cooling solution
Designed as a passive air cooler, the Dynatron J1 excels in heat dissipation without the need for additional fan noise, making it suitable for quiet environments. - High thermal capacity
With a TDP of up to 260 W, this heatsink provides excellent cooling capabilities for demanding processors, ensuring reliable performance during intense workloads. - Durable and reliable materials
Constructed from copper with a vapor chamber base, the J1 enhances thermal conductivity and ensures long-lasting performance and stability in high-performance applications. - Convenient installation
The pre-applied Thermal Grease Shin-Etsu 7762 simplifies the setup process, facilitating a hassle-free installation while optimizing thermal contact between the processor and heatsink.
Special Fetures
- Passive air cooler for effective thermal management
- Compatible with Socket SP5 for versatile installation
- Copper construction with vapor chamber base for enhanced heat dissipation
- Supports TDP up to 260 W for high-performance CPUs
- Pre-applied Thermal Grease Shin-Etsu 7762 for convenient setup
Product Specification
| Product Type | Processor heatsink - passive |
| Height (Rack Units) | 1U |
| Width | 9.24 cm |
| Depth | 11.8 cm |
| Height | 2.5 cm |
| Weight | 612 g |
| Heatsink & Fan | |
| Compatible With | Socket SP5 |
| Heatsink Material | Copper with vapour chamber base |
| Features | TDP up to 260W, Thermal Grease Shin-Etsu 7762 pre-printed |
Features - DYNABOOK - A 2746 / J1
More Details
Product Code
07:212879
EAN Code
0859300007147
Manufacturer
DYNABOOK
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