Iceberg Thermal IceSleet X7 Dual - Processor cooler - (for: LGA775, AM2+, LGA1366, AM3+, FM1, FM2+, LGA2011-3, AM4, LGA2066, LGA1200, LGA2011-0, LGA1700, AM5, LGA115x Socket) - aluminium and copper - 120 mm | ICESLEETX7-D0A

Product Features

• Mechanical automatic start/stop
  Creates a quiet environment and reduces power consumption, decreasing heat, to create a more comfortable work/play experience. When the fan is in off mode it goes silent, until the PWM duty cycle reaches 21% loading.
• Complete bond soldering
  Complete bond soldering between fin sheets, not a stacked fin array. Soldering bond creates an optimum utilization of the cooler. 2 mm fin air gaps, for the better balance between airflow and surface contact, to achieve rapid heat dissipation.
• Optimized heat control
  Large copper base fully covers the chip set for maximum heat dissipation.
• 7 symmetrically designed tuned copper heat pipes
  Heat pipe architecture design with wide sweeping curves to increase your PC's performance. 45 mm RAM clearance allows the space to accommodate RAM modules.
• Dual heat sink towers with dual fans for double the effectiveness
  Two heat sinks connected to the heat pipes with one 120 mm fan and one 140 mm fan. This provides the pinnacle in push-pull technology, creating optimum airflow, allowing you to overclock!

Special Fetures

• Mechanical automatic start/stop
• Complete bond soldering
• Optimized heat control
• 7 symmetrically designed tuned copper heat pipes
• Dual heat sink towers with dual fans for double the effectiveness

Product Specification